Christopher Yows & Dr. Pepper Case At The Structural Packaging Summit
The “Structural Packaging Summit,” is approaching in Feb/March of 2012 and Marc Drucker, President of Newlogic will be discussing patent reform coming and the dramatic change it will have on R&D. As we ramp up for the summit, we thought we’d interview some of the other presenters.
Christopher Yows is a 17 year veteran a R&D/Leverage, and runs its Structural Brand Development Business unit. He will be co-presenting with Patrick George Director of Engineering at Dr. Pepper Snapple Group on the topic, Rapid Refresh in 28 weeks – An “Idea to tool” process.
Structural Packaging Summit 2012
The “Structural Packaging Summit,” is nearly here (February 28th – March 1st) and Newlogic’s own, Marc Drucker, will be presenting on patent reform and the effect it will have on packaging R&D.
Marc Drucker will present, "Are You Prepared for the Effect that Patent Reform Laws Will Have on Packaging R&D?" Key takeaways include, first to file, post-grant review, and fee collection; a review of these new rules and what the packaging R&D leader needs to do to prepare. What patent reform means for the framework and process of packaging project design and development. A review of industry leaders and suppliers, providing insights on how the packaging R&D professional can prepare for patent reform. Tools to help manage patent reform for R&D.
Here is a comprehensive list of some of the people and aspects of SPS that will be on display…